Semi-Automated Wafer Inspection System
SemDex 301
♦ Manual loading, automated measurement
♦ Standalone instrument with integrated PC and monitor
♦ Accepts wafers measuring up to 300mm (12"), for measurement on both sides
♦ Framed and unframed wafers
♦ Single, twin, triple, or quadro sensor configuration
♦ Optional vacuum chucks, also for measurement of both sides
♦ Integrated vacuum generation for fixing wafers
♦ Optionally available with high-resolution HK CMOS camera
♦ Air-suspended measuring table for vibration-free measurement
♦ x/y-precision measuring stage with precise stepping motor positioning
♦ Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
♦ Coated steel housing or stainless steel housing for clean room operation
♦ SEMI S2- and S8-compliant ergonomics
♦ User-friendly WaferSpect software
♦ Optional: SECS/GEM software package - integrated communication interface between fabrication and device
冲成股份有限公司 / JC's Chunson Limited
Tel:+886-2-3234-1279 Fax:+886-3234-7056
Add.:No. 764, Zhong-Zheng Road, Zhong-He, New Taipei City 23586, Taiwan