Semi-Automated Wafer Inspection System

SemDex 301

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♦ Manual loading, automated measurement

♦ Standalone instrument with integrated PC and monitor

♦ Accepts wafers measuring up to 300mm (12"), for measurement on both sides

♦ Framed and unframed wafers

♦ Single, twin, triple, or quadro sensor configuration

♦ Optional vacuum chucks, also for measurement of both sides

♦ Integrated vacuum generation for fixing wafers

♦ Optionally available with high-resolution HK CMOS camera

♦ Air-suspended measuring table for vibration-free measurement

♦ x/y-precision measuring stage with precise stepping motor positioning

♦ Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)

♦ Coated steel housing or stainless steel housing for clean room operation

♦ SEMI S2- and S8-compliant ergonomics

♦ User-friendly WaferSpect software

♦ Optional: SECS/GEM software package - integrated communication interface between fabrication and device